Engage with our process experts to build finished products that help achieve your goals

 

WAFER CUT DOWN AND SHAPING SERVICES


Wafer cut down and shaping services

Custom wafer thickness and flatness

Waterjet cutting and shaping

Patterned wafer cutting and dicing

Edge trimming

Hole cutting

Prototyping

Round and notch capabilities on small diameters

Laser marking on small diameters


 

SCRAP WAFER RECYCLING


We can provide a recycling program to repurpose your broken or scrapped whole wafers

CERTIFIED PATTERN WAFER DISTRUCTION

For patterned or IP sensitive wafers, we offer a safe method for destroying wafers

Tier 1 provides a formal certification of the customer products destroyed



SCRAP WAFER RECYCLING


We can provide a recycling program to repurpose your broken or scrapped whole wafers

CERTIFIED PATTERN WAFER DISTRUCTION

For patterned or IP sensitive wafers, we offer a safe method for destroying wafers

Tier 1 provides a formal certification of the customer products destroyed



SPECIALTY GRIND


Single side and double side grinding

Edge grinding and shaping

Wafer thinning down to 75µm

Thick wafers up to 3 mm

Ultra flat single side and double side polished wafers